Panatec & Perfect Industries Pte Ltd

specializes in low to medium volume, high mix/high complexity printed circuit board assembly utilizing surface mount technology(SMT) placement including ball grid array(BGA) as well as plated through hole(PTH) printed circuit board assemblies

Package on Package (POP)

Chip-Scale-Package(CSP)

Press fit connectors

Multi layer PCB

Rigid PCB / Rigid Flex

Flex Circuit Assembly

01005 package components

0.4mm Pitch for QFP

0.5mm Pitch for BGA

0.3mm Ball size for BGA/uBGA

50mm square(Max.) for QFP & BGA

0.3mm Ball size for BGA/uBGA